3 D Multilayer Copper Interconnects For High Performance Monolithic Devices And Passives.pdf
"3-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passives" is owned and hosted by archives-ouvertes.fr, this file has been downloaded 86 times, the last time was in 2025-04-09.
Ayad Ghannam, David Bourrier, Lamine Ourak, Christophe Viallon, Thierr is the creator of TCPMT_2012_Final.pdf.
The pdf has been created in 2020-10-01, if you want to preview or download it, just click the link below.
| Download | ||
| Title | 3-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passives | |
| File Name | TCPMT_2012_Final.pdf - 1.53 MB | |
| Pages | 9 pages | |
| Owner | archives-ouvertes.fr | |
| Author | Ayad Ghannam, David Bourrier, Lamine Ourak, Christophe Viallon, Thierr | |
| Creation date | 4 years ago | |
| Nb of downloads | 86 | |
If you are the owner and you want to remove this file from our databse, please contact us, we will remove it within 24 hours.
If "3 D Multilayer Copper Interconnects for High Performance Monolithic Devices and Passives" does not meet your expectations, we invite you to take a look at the similar files below :